Join us at the 2025 P3DL
- 25-29 August 2025
- NGA Campus East
Conference Center
7500 GEOINT Drive
Springfield, VA 22150
2025 P3DL CoP Conference
Please join BAE Systems Geospatial eXploitation Products™ (GXP®) at the 2025 P3DL, 25–29 August, in Springfield, VA.
GXP software enables rapid, accurate, and informed decision making across key military, public safety and security operations, as well as a variety of commercial development and research initiatives. As global events continue to drive time-dominant missions in an increasingly data-driven ISR environment, attendees will learn how GXP software solutions are addressing this evolution through:
- Convergence of multi-source intelligence to identify complex data patterns and relationships
- Innovative advancements in Imagery, Video, and Moving Target Indicator exploitation
- Enhanced data analytics leveraging AI/ML to optimize work force productivity
- Containerized solutions enabling optimized deployment anywhere, at any scale
- Customized workflows to maximize mission efficiency and decision speed
BAE Systems GXP Presentation
SAM2 segmentation for improved DSM building sharpness
Delivering enhanced accuracy and efficiency in terrain modeling, this presentation demonstrates cutting-edge improvements to Digital Surface Model (DSM) generation from satellite imagery using the GXP Ecosystem. By adapting the Segment Anything Model v2 (SAM2) to satellite imagery and integrating it with super-resolution and 3-D object detection AI, this Intelligent Automatic Feature Extraction (IAFE) pipeline achieves highly precise building extraction in three dimensions (including complex roof structures). Attendees will discover how these advances yield sharper building footprints, cleaner vertical surfaces, and significantly improved bare-earth Digital Elevation Models (DEMs) for mission-critical geospatial workflows.
Official Event Description
The goal of the conference is to collaboratively drive innovation and explore capabilities for precision geopositioning/targeting, precision mensuration, 3D visualization, lidar, and 3D data related technologies to help answer current and emerging DoD and IC needs. Attendees from across the U.S. government, academia, and industry are invited to collaborate on innovations in sensor advancement, algorithm development, and tradecraft. We endeavor to create an environment where participants can discuss successes and challenges, and exchange ideas on future work.